"Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs."

Arjun Chaudhuri et al. (2019)

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DOI: 10.1109/ETS.2019.8791515

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS 2019: 1-6

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