"Adaptive chip-package thermal analysis for synthesis and design."

Yonghong Yang et al. (2006)

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DOI: 10.1109/DATE.2006.243742

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li Shang, Robert P. Dick:
Adaptive chip-package thermal analysis for synthesis and design. DATE 2006: 844-849

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