"Pre-bond testing of the silicon interposer in 2.5D ICs."

Ran Wang et al. (2016)

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DOI: —

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type: Conference or Workshop Paper

metadata version: 2021-08-09

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Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Pre-bond testing of the silicon interposer in 2.5D ICs. DATE 2016: 978-983

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