"An enhanced double-TSV scheme for defect tolerance in 3D-IC."

Hsiu-Chuan Shih, Cheng-Wen Wu (2013)

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DOI: 10.7873/DATE.2013.302

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Hsiu-Chuan Shih, Cheng-Wen Wu:
An enhanced double-TSV scheme for defect tolerance in 3D-IC. DATE 2013: 1486-1489

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