"A quantitative analysis of performance benefits of 3D die stacking on ..."

Dongki Kim et al. (2011)

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DOI: 10.1109/DATE.2011.5763214

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung:
A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC. DATE 2011: 1333-1338

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