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"Fast chip-package-PCB coanalysis methodology for power integrity of ..."
Seungwon Kim et al. (2018)
- Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang:
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study. DATE 2018: 885-888
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