"Low-power 3D integration using inductive coupling links for ..."

Benjamin J. Fletcher et al. (2018)

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DOI: 10.23919/DATE.2018.8342200

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak:
Low-power 3D integration using inductive coupling links for neurotechnology applications. DATE 2018: 1211-1216

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