"3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory ..."

Yi-Chung Chen et al. (2011)

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DOI: 10.1109/DATE.2011.5763289

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Yi-Chung Chen, Hai Li, Yiran Chen, Robinson E. Pino:
3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers. DATE 2011: 583-586

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