"Electrothermal simulation of bonding wire degradation under uncertain ..."

Thorben Casper et al. (2016)

> Home

Details and statistics

DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-09

- view
  - electronic edition @ ieee.org
- export record
  dblp key:
  - conf/date/CasperGGGKMS16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/date/CasperGGGKMS16
Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps:
Electrothermal simulation of bonding wire degradation under uncertain geometries. DATE 2016: 1297-1302

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.