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"Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for ..."

Jinwoo Kim et al. (2021)

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DOI: 10.1109/DAC18074.2021.9586229

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/dac/KimZTSL21
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Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. DAC 2021: 1189-1194

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