"AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous ..."

Yiqi Jing et al. (2024)

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DOI: 10.1145/3649329.3657373

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-12

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Yiqi Jing, Meng Wu, Jiaqi Zhou, Yiyang Sun, Yufei Ma, Ru Huang, Tianyu Jia, Le Ye:
AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration. DAC 2024: 145:1-145:6

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