"Small delay testing for TSVs in 3-D ICs."

Shi-Yu Huang et al. (2012)

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DOI: 10.1145/2228360.2228546

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter, Yung-Fa Chou, Ding-Ming Kwai:
Small delay testing for TSVs in 3-D ICs. DAC 2012: 1031-1036

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