"Automated inspection of solder bumps using visual signatures of specular ..."

Rajarshi Ray (1989)

> Home

Details and statistics

DOI: 10.1109/CVPR.1989.37906

access: closed

type: Conference or Workshop Paper

metadata version: 2018-03-08

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/cvpr/Ray89
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/cvpr/Ray89
Rajarshi Ray:
Automated inspection of solder bumps using visual signatures of specular image-highlights. CVPR 1989: 588-596

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.