"Cool System scalable 3-D stacked heterogeneous Multi-Core / Multi-Chip ..."

Yukoh Matsumoto et al. (2012)

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DOI: 10.1109/COOLCHIPS.2012.6216584

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Yukoh Matsumoto, Tomoyuki Morimoto, Michiya Hagimoto, Hiroyuki Uchida, Nobuyuki Hikichi, Fumito Imura, Hiroshi Nakagawa, Masahiro Aoyagi:
Cool System scalable 3-D stacked heterogeneous Multi-Core / Multi-Chip architecture for ultra low-power digital TV applications. COOL Chips 2012: 1-3

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