"Thermal characterization of a QFN electronic Package accompanied by a ..."

Omar Bendaou et al. (2016)

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DOI: 10.1109/CIST.2016.7804965

access: closed

type: Conference or Workshop Paper

metadata version: 2022-04-09

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Omar Bendaou, Otmane Bendaou, Abdelkhalak El Hami, Mohamed Agouzoul:
Thermal characterization of a QFN electronic Package accompanied by a reliability study based on a response surface approach. CIST 2016: 644-647

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