"Simulation methodology and flow integration for 3D IC stress management."

Mark Nakamoto et al. (2010)

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DOI: 10.1109/CICC.2010.5617422

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Mark Nakamoto, Riko Radojcic, Wei Zhao, Vinay K. Dasarapu, Aditya P. Karmarkar, Xiaopeng Xu:
Simulation methodology and flow integration for 3D IC stress management. CICC 2010: 1-4

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