"MEMS wafer-level vacuum packaging with transverse interconnects for CMOS ..."

Dominique Lemoine et al. (2008)

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DOI: 10.1109/CICC.2008.4672055

access: closed

type: Conference or Workshop Paper

metadata version: 2017-06-02

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Dominique Lemoine, Paul-Vahe Cicek, Frederic Nabki, Mourad N. El-Gamal:
MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration. CICC 2008: 189-192

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