"3D Capacitive Interconnections for High Speed Interchip Communication."

Roberto Canegallo et al. (2007)

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DOI: 10.1109/CICC.2007.4405670

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri:
3D Capacitive Interconnections for High Speed Interchip Communication. CICC 2007: 1-8

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