"Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D ..."

Freddie Taewoo Hong, Connor Myant, David E. Boyle (2021)

> Home

Details and statistics

DOI: 10.1145/3411764.3445469

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/chi/HongMB21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/chi/HongMB21
Freddie Taewoo Hong, Connor Myant, David E. Boyle:
Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending. CHI 2021: 669:1-669:10

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.