"A Motion Analysis System for Danger Prediction During Soldering Process."

Kyohei Wakabayashi, Tetsuya Oda, Leonard Barolli (2024)

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DOI: 10.1007/978-3-031-76452-3_27

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-21

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Kyohei Wakabayashi, Tetsuya Oda, Leonard Barolli:
A Motion Analysis System for Danger Prediction During Soldering Process. BWCCA 2024: 285-293

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