"Defect detection of biscuit packaging based on level set map."

Kunkun Xiong et al. (2022)

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DOI: 10.1109/CISP-BMEI56279.2022.9979906

access: closed

type: Conference or Workshop Paper

metadata version: 2024-06-10

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Kunkun Xiong, Wensheng Li, Shuai Dong, Yuanlie He, Zhihua Yang:
Defect detection of biscuit packaging based on level set map. CISP-BMEI 2022: 1-7

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