"High Density Cell Electrofusion on Chip using an Array of Non-connected ..."

Feriel Hamdi et al. (2013)

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type: Conference or Workshop Paper

metadata version: 2014-09-23

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Feriel Hamdi, Wei Wang, Frédéric Subra, Elisabeth Dufour-Gergam, Olivier Français, Bruno Le Pioufle:
High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads. BIODEVICES 2013: 68-72

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