"Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and ..."

Yasuo Saito et al. (2018)

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DOI: 10.1109/BCICTS.2018.8551037

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-16

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Yasuo Saito, Tatsuhiko Aizawa, Kenji Wasa, Yoshiro Nogami:
Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients. BCICTS 2018: 243-246

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