"Performance Characterization of TSV in 3D IC via Sensitivity Analysis."

Jhih-Wei You et al. (2010)

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DOI: 10.1109/ATS.2010.73

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Jhih-Wei You, Shi-Yu Huang, Ding-Ming Kwai, Yung-Fa Chou, Cheng-Wen Wu:
Performance Characterization of TSV in 3D IC via Sensitivity Analysis. Asian Test Symposium 2010: 389-394

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