"Power distribution network modeling for 3-D ICs with TSV arrays."

Chi-Kai Shen et al. (2013)

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DOI: 10.1109/ASPDAC.2013.6509552

access: closed

type: Conference or Workshop Paper

metadata version: 2017-06-15

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Chi-Kai Shen, Yi-Chang Lu, Yih-Peng Chiou, Tai-Yu Cheng, Tzong-Lin Wu:
Power distribution network modeling for 3-D ICs with TSV arrays. ASP-DAC 2013: 17-22

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