"A 3D prototyping chip based on a wafer-level stacking technology."

Nobuaki Miyakawa (2009)

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DOI: 10.1109/ASPDAC.2009.4796516

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Nobuaki Miyakawa:
A 3D prototyping chip based on a wafer-level stacking technology. ASP-DAC 2009: 416-420

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