"Analytical model of internal heat transfer of a power chip with through ..."

Jingyu Liu et al. (2017)

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DOI: 10.1109/ASICON.2017.8252544

access: closed

type: Conference or Workshop Paper

metadata version: 2018-01-17

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Jingyu Liu, Yongyong Wang, Xunyong Yang, Fashun Yang, Kui Ma:
Analytical model of internal heat transfer of a power chip with through silicon via. ASICON 2017: 588-591

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