"Built-in self-test/repair scheme for TSV-based three-dimensional ..."

Hung-Yen Huang, Yu-Sheng Huang, Chun-Lung Hsu (2010)

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DOI: 10.1109/APCCAS.2010.5774885

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Hung-Yen Huang, Yu-Sheng Huang, Chun-Lung Hsu:
Built-in self-test/repair scheme for TSV-based three-dimensional integrated circuits. APCCAS 2010: 56-59

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