"On the wafer/pad friction of linear chemical-mechanical planarization ..."

Jingang Yi (2004)

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DOI: 10.23919/ACC.2004.1384621

access: closed

type: Conference or Workshop Paper

metadata version: 2022-11-24

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Jingang Yi:
On the wafer/pad friction of linear chemical-mechanical planarization (CMP): modeling, analysis and experiments. ACC 2004: 4873-4878

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