"Development of a distributed Bernoulli gripper for ultra-thin wafer handling."

Dong Liu et al. (2017)

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DOI: 10.1109/AIM.2017.8014028

access: closed

type: Conference or Workshop Paper

metadata version: 2022-04-09

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Dong Liu, Wenyu Liang, Haiyue Zhu, Chek Sing Teo, Kok Kiong Tan:
Development of a distributed Bernoulli gripper for ultra-thin wafer handling. AIM 2017: 265-270

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