"Thermal Flow Simuation and Measurements of 3D Si Chip Stacks with TSVs."

Shuhei Yokota et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830034

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata:
Thermal Flow Simuation and Measurements of 3D Si Chip Stacks with TSVs. 3DIC 2024: 1-3

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