"IC-package co-design and analysis for 3D-IC designs."

Thomas Whipple et al. (2009)

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DOI: 10.1109/3DIC.2009.5306589

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Thomas Whipple, Taranjit Kukal, Keith Felton, Vassilios Gerousis:
IC-package co-design and analysis for 3D-IC designs. 3DIC 2009: 1-6

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