"Low-temperature bottom-up integration of carbon nanotubes for vertical ..."

Sten Vollebregt et al. (2011)

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DOI: 10.1109/3DIC.2012.6262989

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-29

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Sten Vollebregt, Ryoichi Ishihara, Johan van der Cingel, Kees Beenakker:
Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. 3DIC 2011: 1-4

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