"Vias-last process technology for thick 2.5D Si interposers."

Erik Vick et al. (2011)

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DOI: 10.1109/3DIC.2012.6262990

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Erik Vick, Scott H. Goodwin, Garry Cunnigham, Dorota Temple:
Vias-last process technology for thick 2.5D Si interposers. 3DIC 2011: 1-4

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