"Process Complexity and Cost Considerations of Multi-Layer Die Stacks."

Dimitrios Velenis et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058876

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne:
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC 2019: 1-6

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