"Copper filled TSV formation with Parylene-HT insulator for low-temperature ..."

Bui Thanh Tung et al. (2014)

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DOI: 10.1109/3DIC.2014.7152162

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-05

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  - conf/3dic/TungCWKKA14
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Bui Thanh Tung, Xiaojin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Masahiro Aoyagi:
Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration. 3DIC 2014: 1-4

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