"An Accurate Assessment of Chip-Package Interaction is a Key Factor for ..."

Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy (2019)

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DOI: 10.1109/3DIC48104.2019.9058854

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy:
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3DIC 2019: 1-6

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