"Electrical interconnect test method of 3D ICs by injected charge volume."

Daisuke Suga et al. (2015)

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DOI: 10.1109/3DIC.2015.7334588

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Daisuke Suga, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu:
Electrical interconnect test method of 3D ICs by injected charge volume. 3DIC 2015: TS8.19.1-TS8.19.6

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