"Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to ..."

Akihiro Shimizu et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830231

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type: Conference or Workshop Paper

metadata version: 2025-01-23

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Akihiro Shimizu, Kazuhiro Fukada, Shinichi Endo, Mitsuru Abe, Akiko Matsui:
Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission Loss. 3DIC 2024: 1-4

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