"Using TSVs for thermal mitigation in 3D circuits: Wish and truth."

Cristiano Santos et al. (2014)

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DOI: 10.1109/3DIC.2014.7152167

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-21

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Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy:
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC 2014: 1-8

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