"Thermal implications of mobile 3D-ICs."

Mehdi Saedi et al. (2014)

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DOI: 10.1109/3DIC.2014.7152160

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal:
Thermal implications of mobile 3D-ICs. 3DIC 2014: 1-7

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