"Heat spreading packaging solutions for hybrid bonded 3D-ICs."

Rafael Prieto et al. (2016)

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DOI: 10.1109/3DIC.2016.7970038

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-08

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Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, Venceslass Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy:
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC 2016: 1-6

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