"Long term efficacy of ultra-thin Ti passivation layer for achieving low ..."

Asisa Kumar Panigrahi et al. (2015)

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DOI: 10.1109/3DIC.2015.7334582

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type: Conference or Workshop Paper

metadata version: 2020-10-25

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Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. 3DIC 2015: TS8.13.1-TS8.13.5

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