"Arithmetic unit design using 180nm TSV-based 3D stacking technology."

Jin Ouyang et al. (2009)

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DOI: 10.1109/3DIC.2009.5306565

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-19

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Jin Ouyang, Guangyu Sun, Yibo Chen, Lian Duan, Tao Zhang, Yuan Xie, Mary Jane Irwin:
Arithmetic unit design using 180nm TSV-based 3D stacking technology. 3DIC 2009: 1-4

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