"Novel detachable bonding process with wettability control of bonding ..."

Yuki Ohara et al. (2011)

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DOI: 10.1109/3DIC.2012.6262950

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Yuki Ohara, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. 3DIC 2011: 1-4

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