"Silicon interposer platform with low-loss through-silicon vias using air."

Hanju Oh, Gary S. May, Muhannad S. Bakir (2015)

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DOI: 10.1109/3DIC.2015.7334621

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Hanju Oh, Gary S. May, Muhannad S. Bakir:
Silicon interposer platform with low-loss through-silicon vias using air. 3DIC 2015: TS11.3.1-TS11.3.4

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