"Highly conformal and adhesive electroless barrier and Cu seed formation ..."

S. Nishizawa et al. (2013)

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DOI: 10.1109/3DIC.2013.6702392

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue:
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. 3DIC 2013: 1-4

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