"3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous ..."

Revanth Nadipalli et al. (2011)

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DOI: 10.1109/3DIC.2012.6262956

access: closed

type: Conference or Workshop Paper

metadata version: 2022-04-19

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Revanth Nadipalli, Ji Fan, Holden King Ho Li, Keng Hoong Wee, Hao Yu, Chuan Seng Tan:
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. 3DIC 2011: 1-5

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