"Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI ..."

Mariappan Murugesan et al. (2021)

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DOI: 10.1109/3DIC52383.2021.9687604

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

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Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC 2021: 1-4

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