"Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding."

Mariappan Murugesan et al. (2010)

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DOI: 10.1109/3DIC.2010.5751432

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5

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